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Contact e-mail: kobayashi@cs.kumamoto-u.ac.jp

Professor Makiko Kobayashi: Pioneering Researcher in Piezoelectric Materials and Ultrasonic Sensors. Prof. Makiko Kobayashi, a Senior Member of the IEEE, has made significant contributions to the field of electrical engineering. Her journey is marked by relentless curiosity, innovation, and dedication. Born in London, United Kingdom, Prof. Kobayashi began her academic path at Chiba University in Japan, where she earned her B.Eng. and M.Eng. degrees. Later, she pursued her Ph.D. at McGill University in Montreal, Canada, completing her studies in 2004. Prof. Kobayashi’s research interests cover a wide range:

Porous Piezoelectric Materials: She focuses on developing high-temperature ultrasonic transducers using novel porous materials. These materials exhibit remarkable heat resistance, durability, and electrical properties. Her work has implications for various applications, including non-destructive testing and process monitoring.

Biomedical Sensors: Prof. Kobayashi aims to commercialize a new medical sensor. Her research involves creating ultrasonic sensors capable of monitoring health conditions at home. These sensors could revolutionize early diagnosis and personalized healthcare.

Industrial Applications: In pursuit of a low-carbon society, she explores real-time process monitoring for high-temperature technologies. Porous ferroelectric films enable ultrasound sensors that integrate seamlessly into industrial machines, providing critical data for safety and efficiency.

Prof. Kobayashi’s notable achievements include the Young Scientist Award at the 26th Symposium on Ultrasonic Electronics and the 2022 NRC’s IP Achievement Award. Her legacy continues to inspire researchers globally as she bridges theory and practical applications in the fascinating world of piezoelectric materials and sensors.


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The project is co-financed by the national budget, allocated by the Minister of Science and Higher Education under the Excellent Science II Program – Co-financing of Scientific Conferences, grant no. KONF/SP/0473/2023/01.